News and Trade Fair
IC & SENSOR PACKAGING EXPO Takashima Sangyo joins the Integrated Circuit & Sensor Packaging Expo of NEPCON JAPAN 2025 in Tokyo, January 22-25 2025. Venue: Tokyo Big SightTime: January 24-25, 2025Booth: E65-60 Contract services of semiconductor back-end process: wafer back-grinding, dicing, dicing before grinding available. Pre-registration of visitors at official site would be recommended
Takashima Sangyo will present its flame-retardant rubber at Japan Die Casting Congress & Exposition, Nov. 14-16, in Yokohama. Time November 14 – 16 2024Venue Pacifico YokohamaStand No. G-20
Takashima Sangyo has exhibited the latest version of MultiPro6, a compact machining center, at the Japan International Machine Tool Fair, JIMTOF,. Venue Tokyo Big Sight Time November 5 – 10 2024 Our Booth E1040 MultiPro6 employing Selective Compliance Assembly Robot Arm for further productivity improvement (center), and a laser processing model (right)
Takashima presented our expertise in precision machining and small machine tools at a local trade fair, SUWA-KEN KOGYO MESSE, Oct 17-19 2024 the Nagano Suwa Area Industrial Messe 2024. Booth: West 025
Takashima Sangyo introduced new version of Multi-Pro, a small machine tool at Mechanical Components & Materials Technology Expo – Tokyo, June 19 – 21, 2024, as well as precision small parts processed by cutting, laser processing, electric discharging, grinding/lapping, and surface treatment. Venue Tokyo Big Sight Stand No. E40-11
