NEPCON JAPAN, Tokyo, Jan 22-24 2025

IC & SENSOR PACKAGING EXPO

Takashima Sangyo joins the Integrated Circuit & Sensor Packaging Expo of NEPCON JAPAN 2025 in Tokyo, January 22-25 2025.

Venue: Tokyo Big Sight
Time: January 24-25, 2025
Booth: E65-60
Contract services of semiconductor back-end process: wafer back-grinding, dicing, dicing before grinding available.

Pre-registration of visitors at official site would be recommended